![PDF] Design and Fabrication of Bond Pads for Flip-Chip Bonding of Custom Dies to CMOS Dies | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/81ca422bb36b6d17a1e9deb91b8b7e477e72afab/3-Figure2-1.png "PDF] Design and Fabrication of Bond Pads for Flip-Chip Bonding of Custom Dies to CMOS Dies | Semantic Scholar")
PDF] Design and Fabrication of Bond Pads for Flip-Chip Bonding of Custom Dies to CMOS Dies | Semantic Scholar
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Figure 2 from Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications | Semantic Scholar
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Figure 3 from Design of die-pad on exposed substrate (DOES) leadframe package for DDR3 interface applications | Semantic Scholar
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